AS9100 certifiedThe certification has been performed in accordance with the Requirements of AS9104/1 issued 2012-01, including its implementation, and meets the requirements of the standard:
AS9100D (Based on and including ISO 9001:2015)

Automated Hybrid Assembly

Bare die integration for highest performance

I2R Electronics has advanced components and subsystems manufacturing technology utilizing automated assembly of hybrid microwave circuits. The result is superbly consistent quality and performance at high volume and at lower cost using our internally fabricated thin film networks.

Bare die are attached using precision pick and place robotics with eutectic soldering, on pre-deposited AuSn, or AuSn solder preforms. Similarly other chip components are attached with qualified epoxies by automated dispensing and placement equipment. High precision automated wire bonding completes the assembly with consistent wire bond length and loop shapes essential for high frequency RF functions.